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X-ray Orientation Analyzer

Designed according to the round bar crystal, the sample stage has a load-bearing track, which can measure 1~30 kg, 2~6 inches in diameter (can be increased to 8 inches), and a vacuum suction device on the sample stage. This type of goniometer measures the reference surface of a rod-shaped crystal and also measures the surface of a wafer.

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X-ray crystal orientation instrument

TA type sample stage:

TB type sample stage:
Designed according to the round bar crystal, the sample stage is equipped with a load-bearing track and is equipped with a V-shaped support rail. It can measure an ingot with a weight of 1~30 kg, a diameter of 2~6 inches (can be increased to 8 inches) and a length of 500mm. A vacuum suction device is attached to the sample stage. This type of goniometer measures the end face of the rod crystal and also measures the surface of the wafer.

TC type sample stage:
It is mainly used for the detection of the outer circular reference surface of single wafers such as silicon and sapphire. The position of the X-ray receiving on the suction disk adopts an open design, which overcomes the problem that the suction disk blocks X-rays and misalignment, and satisfies different specifications. With the reference edge detection, the suction pump of the sample stage can suck the 2~8 inch wafer to make the detection more accurate.

TD type sample stage:
Mainly used for multi-point measurement of wafers such as silicon and sapphire. The wafer can be manually rotated on the sample stage, such as 0°, 90°, 180°, 270°, etc., to meet the special measurement needs of customers.

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